Amkor to Invest $2 Billion in Chip-Packaging Facility for Apple

Amkor recently announced plans to invest approximately $2 billion in the development of a new chip-packaging and test facility, specifically designed to serve Apple. The facility, which will be located in Peoria, Arizona, is expected to become the largest outsourced advanced packaging facility in the United States.

Employing around 2,000 individuals, this state-of-the-art facility is the result of close collaboration between Amkor and Apple. The two companies have worked together to define the strategic vision and initial manufacturing capability of the facility. The primary purpose of this facility is to package and test chips that are produced for Apple at a nearby TSMC fab. Notably, Apple will be Amkor’s first and largest customer when the new facility opens.

In support of this project, Apple’s Chief Operating Officer, Jeff Williams, expressed the company’s commitment to advancing advanced manufacturing within the United States. This facility serves as a testament to their dedication.

The first phase of the manufacturing plant is anticipated to be fully operational within the next two to three years. Amkor is also actively seeking CHIPS funding to support this endeavor.

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